Inventor
LACAP EFREN M
US13 patents
⚠️ This page may combine multiple inventors who share the name “LACAP EFREN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VOLTERRA SEMICONDUCTOR CORP
4 patentsUS7989953B1Aug 2, 2011
Flip chip power switch with under bump metallization stack
VOLTERRA SEMICONDUCTOR CORP25 citations92
US8680676B1Mar 25, 2014
Semiconductor package with under bump metallization routing
VOLTERRA SEMICONDUCTOR CORP6 citations83
US8933520B1Jan 13, 2015
Conductive routings in integrated circuits using under bump metallization
VOLTERRA SEMICONDUCTOR CORP3 citations62
US8368212B1Feb 5, 2013
Semiconductor package with under bump metallization routing
VOLTERRA SEMICONDUCTOR CORP1 citations62
LACAP EFREN M
4 patentsUS8085553B1Dec 27, 2011
Lead assembly for a flip-chip power switch
LACAP EFREN M30 citations91
US8106516B1Jan 31, 2012
Wafer-level chip scale package
LACAP EFREN M26 citations88
US8942009B2Jan 27, 2015
Lead assembly for a flip-chip power switch
LACAP EFREN M0 citations51
US8710664B2Apr 29, 2014
Wafer-level chip scale package
LACAP EFREN M0 citations48