P

Inventor

CHO SOON JIN

KR13 patents
⚠️ This page may combine multiple inventors who share the name “CHO SOON JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

5 patents
US7875340B2Jan 25, 2011

Heat radiation substrate having metal core and method of manufacturing the same

SAMSUNG ELECTRO MECH25 citations92
US7981728B2Jul 19, 2011

Coreless substrate

SAMSUNG ELECTRO MECH11 citations83
US7517730B2Apr 14, 2009

Coreless substrate and manufacturing method thereof

SAMSUNG ELECTRO MECH12 citations83
US7736952B2Jun 15, 2010

Wafer packaging method

SAMSUNG ELECTRO MECH0 citations50
US8809122B2Aug 19, 2014

Method of manufacturing flip chip package

SAMSUNG ELECTRO MECH0 citations49

HYUNDAI ELECTRONICS IND

2 patents
US6222259B1Apr 24, 2001

Stack package and method of fabricating the same

HYUNDAI ELECTRONICS IND234 citations98
US6400021B1Jun 4, 2002

Wafer level package and method for fabricating the same

HYUNDAI ELECTRONICS IND93 citations97

LEE SEOK KYU

1 patent
US8445790B2May 21, 2013

Coreless substrate having filled via pad and method of manufacturing the same

LEE SEOK KYU8 citations77

KIM EY YONG

1 patent
US8558360B2Oct 15, 2013

Flip chip package and method of manufacturing the same

KIM EY YONG9 citations76

CHO SEUNG HYUN

1 patent
US8061025B2Nov 22, 2011

Method of manufacturing heat radiation substrate having metal core

CHO SEUNG HYUN2 citations61

YOON TAE SIK

1 patent
US8834077B2Sep 16, 2014

Micro drill and method of fabricating the same

YOON TAE SIK3 citations60

CHO CHUNG-WOO

1 patent
US8535547B2Sep 17, 2013

Printed circuit board manufacturing system and manufacturing method thereof

CHO CHUNG-WOO2 citations54

PARK DONG-JIN

1 patent
US8074352B2Dec 13, 2011

Method of manufacturing printed circuit board

PARK DONG-JIN0 citations51