Inventor
CHOI JIN WON
KR28 patents
⚠️ This page may combine multiple inventors who share the name “CHOI JIN WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
11 patentsUS7875340B2Jan 25, 2011
Heat radiation substrate having metal core and method of manufacturing the same
SAMSUNG ELECTRO MECH25 citations92
US8740040B2Jun 3, 2014
Solder injection head
SAMSUNG ELECTRO MECH22 citations90
US9159693B2Oct 13, 2015
Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same
SAMSUNG ELECTRO MECH11 citations84
US7893355B2Feb 22, 2011
Lead pin for package boards
SAMSUNG ELECTRO MECH10 citations82
US8039761B2Oct 18, 2011
Printed circuit board with solder bump on solder pad and flow preventing dam
SAMSUNG ELECTRO MECH5 citations73
US8952531B2Feb 10, 2015
Packaging method using solder coating ball and package having solder pattern including metal pattern
SAMSUNG ELECTRO MECH3 citations59
US8835302B2Sep 16, 2014
Method of fabricating a package substrate
SAMSUNG ELECTRO MECH0 citations51
US8651356B2Feb 18, 2014
Solder bump forming apparatus and soldering facility including the same
SAMSUNG ELECTRO MECH0 citations51
US7736952B2Jun 15, 2010
Wafer packaging method
SAMSUNG ELECTRO MECH0 citations50
US9142499B2Sep 22, 2015
Lead pin for package substrate
SAMSUNG ELECTRO MECH0 citations49
US8708215B2Apr 29, 2014
Solder ball supplying apparatus
SAMSUNG ELECTRO MECH1 citations48
SAMSUNG ELECTRONICS CO LTD
3 patentsUS9720070B2Aug 1, 2017
Communication device and method for controlling the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US7952826B2May 31, 2011
Method operating hard disk drive on the basis of predicted defect using hierarchical clustering and curve fit
SAMSUNG ELECTRONICS CO LTD4 citations56
US7663826B2Feb 16, 2010
Method and apparatus for copying data from one disc drive to another disc drive
SAMSUNG ELECTRONICS CO LTD0 citations52