Inventor
KIM HYUNG-KUN
KR41 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYUNG-KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS7522649B2Apr 21, 2009
Submount of a multi-beam laser diode module
SAMSUNG ELECTRONICS CO LTD23 citations92
US9902902B2Feb 27, 2018
Quantum dot phosphor for light emitting diode and method of preparing the same
SAMSUNG ELECTRONICS CO LTD5 citations84
US9475984B2Oct 25, 2016
Quantum dot phosphor for light emitting diode and method of preparing the same
SAMSUNG ELECTRONICS CO LTD4 citations84
US9691954B2Jun 27, 2017
Light-emitting diode (LED) package
SAMSUNG ELECTRONICS CO LTD3 citations72
US9090817B2Jul 28, 2015
Quantum dot phosphor for light emitting diode and method of preparing the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7535942B2May 19, 2009
Semiconductor laser device including a light shield plate, semiconductor laser device package, and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7276740B2Oct 2, 2007
Submount for light emitting device
SAMSUNG ELECTRONICS CO LTD4 citations62
US8674379B2Mar 18, 2014
Light-emitting device package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8344399B2Jan 1, 2013
LED package with wide emission range and effective heat dissipation
SAMSUNG ELECTRONICS CO LTD0 citations51
US8748312B2Jun 10, 2014
Method of manufacturing substrate for mounting electronic device
SAMSUNG ELECTRONICS CO LTD1 citations48
US10276629B2Apr 30, 2019
Light emitting device package
SAMSUNG ELECTRONICS CO LTD0 citations40
US9997670B2Jun 12, 2018
Semiconductor light emitting device package
SAMSUNG ELECTRONICS CO LTD0 citations36
SAMSUNG ELECTRO MECH
6 patentsUS7781246B2Aug 24, 2010
Method of manufacturing vertical light emitting device
SAMSUNG ELECTRO MECH13 citations84
US7425083B2Sep 16, 2008
Light emitting device package
SAMSUNG ELECTRO MECH13 citations84
US7514020B2Apr 7, 2009
Silicophosphate-based phosphor and light-emitting device including the same
SAMSUNG ELECTRO MECH11 citations83
US7902563B2Mar 8, 2011
Light emitting diode module with heat spreading plate between capping layer and phosphor layer
SAMSUNG ELECTRO MECH3 citations63
US7985975B2Jul 26, 2011
Light emitting package and light emitting package array formed by coupled electrodes
SAMSUNG ELECTRO MECH0 citations52
US7888153B2Feb 15, 2011
Method of manufacturing vertical light emitting device
SAMSUNG ELECTRO MECH0 citations52
LEE YOUNG JIN
4 patentsUS8633643B2Jan 21, 2014
LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
LEE YOUNG JIN10 citations84
US8203165B2Jun 19, 2012
Ceramic package for headlamp and headlamp modul having the same
LEE YOUNG JIN6 citations73
US8736181B2May 27, 2014
AC driven light emitting device
LEE YOUNG JIN1 citations51
US8247980B2Aug 21, 2012
LED driving circuit and light emitting diode array device
LEE YOUNG JIN1 citations51
SAMSUNG LED CO LTD
3 patentsKIM HYUNG-KUN
3 patentsUS8502240B2Aug 6, 2013
Light-emitting device package and method of manufacturing the same
KIM HYUNG-KUN2 citations62
US8124998B2Feb 28, 2012
Light emitting device package
KIM HYUNG-KUN5 citations62
US8709840B2Apr 29, 2014
Light-emitting device package and method of manufacturing the same
KIM HYUNG-KUN0 citations51