Inventor
HOUGHAM GARETH GEOFFREY
US29 patents
⚠️ This page may combine multiple inventors who share the name “HOUGHAM GARETH GEOFFREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS7276787B2Oct 2, 2007
Silicon chip carrier with conductive through-vias and method for fabricating same
IBM124 citations96
US6109039AAug 29, 2000
Heat transfer in electronic apparatus
IBM79 citations96
US7417315B2Aug 26, 2008
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
IBM12 citations92
US5847860ADec 8, 1998
High density electrochromic display
IBM33 citations92
US7452212B2Nov 18, 2008
Metalized elastomeric electrical contacts
IBM16 citations91
US6636290B1Oct 21, 2003
Methods of forming liquid display panels and the like wherein using two-component epoxy sealant
IBM32 citations90
US7473102B2Jan 6, 2009
Space transforming land grid array interposers
IBM16 citations84
US7442049B2Oct 28, 2008
Electrical connecting device and method of forming same
IBM10 citations84
US7863091B2Jan 4, 2011
Planar array contact memory cards
IBM9 citations83
US5861757AJan 19, 1999
Dynamic solvent permittivity instrument
IBM10 citations74
US6632536B2Oct 14, 2003
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays
IBM9 citations73
US7402053B2Jul 22, 2008
Pin grid array zero insertion force connectors configurable for supporting large pin counts
IBM6 citations72
US7322844B1Jan 29, 2008
Pin grid array zero insertion force connectors configurable for supporting large pin counts
IBM8 citations72
US7556979B2Jul 7, 2009
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
IBM1 citations63
US6404491B1Jun 11, 2002
Rolling multiple internal reflection spectroscopy
IBM3 citations63
US7863089B2Jan 4, 2011
Planar array contact memory cards
IBM2 citations62
US7282790B2Oct 16, 2007
Planar array contact memory cards
IBM2 citations62
US8054095B2Nov 8, 2011
Metalized elastomeric probe structure
IBM4 citations61
US7771208B2Aug 10, 2010
Metalized elastomeric electrical contacts
IBM5 citations61
US7883919B2Feb 8, 2011
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging
IBM0 citations52
US7897878B2Mar 1, 2011
Compliant penetrating packaging interconnect
IBM0 citations51
US7579069B2Aug 25, 2009
Negative coefficient of thermal expansion particles and method of forming the same
IBM1 citations51
US7566959B2Jul 28, 2009
Planar array contact memory cards
IBM0 citations51
HOUGHAM GARETH GEOFFREY
3 patentsUS8832936B2Sep 16, 2014
Method of forming metallized elastomeric electrical contacts
HOUGHAM GARETH GEOFFREY5 citations70
US8241957B2Aug 14, 2012
Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
HOUGHAM GARETH GEOFFREY2 citations61
US8119206B2Feb 21, 2012
Negative coefficient of thermal expansion particles
HOUGHAM GARETH GEOFFREY4 citations58