Inventor

ZHAO SAM ZIQUN

US114 patents

⚠️ This page may combine multiple inventors who share the name “ZHAO SAM ZIQUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHAO SAM ZIQUN

BROADCOM CORP

Ball grid array package enhanced with a thermal and electrical connector

Die-up ball grid array package with patterned stiffener opening

Ball grid array package with patterned stiffener layer

Ball grid array package with multiple interposers

Leadframe IC packages having top and bottom integrated heat spreaders

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Interconnect structure and formation for package stacking of molded plastic area array package

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Flip chip package including a non-planar heat spreader and method of making the same

Method of assembling a ball grid array package with patterned stiffener layer

Die-down ball grid array package with die-attached heat spreader and method for making the same

Thermally and electrically enhanced ball grid array packaging

Die down ball grid array package

Ball grid array package enhanced with a thermal and electrical connector

Ball grid array package with stepped stiffener layer

Method for assembling a ball grid array package with multiple interposers

Die-up ball grid array package with enhanced stiffener

Ball grid array package fabrication with IC die support structures

Method for making an enhanced die-up ball grid array package with two substrates

Enhanced die-up ball grid array package with two substrates

Semiconductor package with interface substrate having interposer

Semiconductor package including an organic substrate and interposer having through-semiconductor vias

Die down ball grid array packages and method for making same

Ball grid array package enhanced with a thermal and electrical connector

Flip chip package including a non-planar heat spreader and method of making the same

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Enhanced die-up ball grid array packages and method for making the same

IC die support structures for ball grid array package fabrication

Hybrid thermal interface material for IC packages with integrated heat spreader

Method for assembling a ball grid array package with two substrates

Semiconductor package with a bridge interposer

Enhanced die-down ball grid array and method for making the same

Interposer package-on-package structure

ZHAO SAM ZIQUN

Thermal improvement for hotspots on dies in integrated circuit packages

Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding

Integrated circuit (IC) package stacking and IC packages formed by same

Ball grid array package enhanced with a thermal and electrical connector

Electromagnetic interference shield with integrated heat sink

Semiconductor packages with integrated heat spreaders

Semiconductor package with integrated selectively conductive film interposer

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

KHAN REZAUR RAHMAN

Organic interface substrate having interposer with through-semiconductor vias

Package 3D interconnection and method of making same

Interposer for die stacking in semiconductor packages and the method of making the same

KARIKALAN SAMPATH K V

Semiconductor package with integrated electromagnetic shielding

Semiconductor package with a bridge interposer

BRAODCOM CORP

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

SAEIDI SEYED MAHDI

Hybrid thermal interface material for IC packages with integrated heat spreader

ROFOUGARAN AHMADREZA REZA

Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments