Inventor

HENG CHAI WEI

MY4 patents

⚠️ This page may combine multiple inventors who share the name “HENG CHAI WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

2 patents

US7674657B2Mar 9, 2010

Method of manufacture of encapsulated package

INFINEON TECHNOLOGIES AG2 citations56

US8377753B2Feb 19, 2013

Method of fabricating a semiconductor device having a resin with warpage compensated structures

INFINEON TECHNOLOGIES AG0 citations48

LOW KHAI HUAT JEFFREY

1 patent

US8207601B2Jun 26, 2012

Electronic component and a method of fabricating an electronic component

LOW KHAI HUAT JEFFREY2 citations53

HENG CHAI WEI

1 patent

US8067841B2Nov 29, 2011

Semiconductor devices having a resin with warpage compensated surfaces

HENG CHAI WEI3 citations53