Inventor

DORAISAMY STANLEY JOB

MY10 patents

⚠️ This page may combine multiple inventors who share the name “DORAISAMY STANLEY JOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

3 patents

US7791182B2Sep 7, 2010

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

INFINEON TECHNOLOGIES AG5 citations57

US7723165B2May 25, 2010

Method of forming component package

INFINEON TECHNOLOGIES AG0 citations49

US8377753B2Feb 19, 2013

Method of fabricating a semiconductor device having a resin with warpage compensated structures

INFINEON TECHNOLOGIES AG0 citations48

NXP USA INC

1 patent

US10787361B2Sep 29, 2020

Sensor device with flip-chip die and interposer

NXP USA INC2 citations68

MOHAMED ABDUL RAHMAN

1 patent

US8642394B2Feb 4, 2014

Method of manufacturing electronic device on leadframe

MOHAMED ABDUL RAHMAN5 citations65

MAHLER JOACHIM

1 patent

US8110906B2Feb 7, 2012

Semiconductor device including isolation layer

MAHLER JOACHIM2 citations60

HENG CHAI WEI

1 patent

US8067841B2Nov 29, 2011

Semiconductor devices having a resin with warpage compensated surfaces

HENG CHAI WEI3 citations53

CHAN SOON KANG

1 patent

US9171786B1Oct 27, 2015

Integrated circuit with recess for die attachment

CHAN SOON KANG2 citations52

DORAISAMY STANLEY JOB

1 patent

US9136399B2Sep 15, 2015

Semiconductor package with gel filled cavity

DORAISAMY STANLEY JOB2 citations50

WONG WAI KEONG

1 patent

US9293395B2Mar 22, 2016

Lead frame with mold lock structure

WONG WAI KEONG0 citations36