Inventor

MII YUH-JIER

TW26 patents

⚠️ This page may combine multiple inventors who share the name “MII YUH-JIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MII YUH-JIER

TAIWAN SEMICONDUCTOR MFG

Semiconductor structure having an air-gap region and a method of manufacturing the same

Circuit and method for an SRAM with reduced power consumption

Test site and a method of monitoring via etch depths for semiconductor devices

Read-preferred SRAM cell design

Accurate capacitance measurement for ultra large scale integrated circuits

Method of making a semiconductor device including barrier layers for copper interconnect

Process design for wafer edge in VLSI

Process design for wafer edge in vlsi

Method and system for bonding 3D semiconductor devices

Read-preferred SRAM cell design

Accurate capacitance measurement for ultra large scale integrated circuits

Method and apparatus for improving gate contact

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor structure having an air-gap region and a method of manufacturing the same

Transistorless memory cell

Transistorless memory cell

Transistorless memory cell

WANG PING-WEI

Methods and apparatus for SRAM bit cell with low standby current, low supply voltage and high speed

HUANG CHENG-LIN

Partial air gap formation for providing interconnect isolation in integrated circuits

TAIWAN SEMICONDUCTOR MANUFACTO

Test site and a method of monitoring via etch depths for semiconductor devices

SU SHU-HUI

Semiconductor structure having an air-gap region and a method of manufacturing the same

CHUANG HARRY HAK-LAY

Method and apparatus for improving gate contact

HOU YUNG-CHIN

Contact implement structure for high density design

LIU NAI-WEI

Barrier layers for copper interconnect

TSAI HSIN-YI

Method and apparatus of forming a via

DOONG YIH-YUH

Accurate capacitance measurement for ultra large scale integrated circuits

LIU CHUNG-SHI

Method and system for bonding 3D semiconductor device