P

Inventor

KIM TAE HYEOK

KR15 patents
⚠️ This page may combine multiple inventors who share the name “KIM TAE HYEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

14 patents
US9048026B2Jun 2, 2015

Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH12 citations84
US9627139B2Apr 18, 2017

Multilayered ceramic capacitor and board for mounting the same

SAMSUNG ELECTRO MECH3 citations73
US9343229B2May 17, 2016

Multilayer ceramic capacitor and board having the same mounted thereon

SAMSUNG ELECTRO MECH3 citations71
US9263185B2Feb 16, 2016

Multilayer ceramic capacitor and circuit board for mounting the same

SAMSUNG ELECTRO MECH2 citations63
US11101075B2Aug 24, 2021

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations61
US10892100B2Jan 12, 2021

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations51
US10748712B2Aug 18, 2020

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations51
US11133131B2Sep 28, 2021

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations49
US9847172B2Dec 19, 2017

Embedded device, and printed circuit board having the same

SAMSUNG ELECTRO MECH0 citations48
US11127531B2Sep 21, 2021

Multilayer ceramic electronic component having dummy electrodes in cover layer of body thereof

SAMSUNG ELECTRO MECH0 citations47
US9299497B2Mar 29, 2016

Multilayer ceramic capacitor and board for mounting the same

SAMSUNG ELECTRO MECH0 citations42
US9208950B2Dec 8, 2015

Multilayer ceramic capacitor and board for mounting the same

SAMSUNG ELECTRO MECH0 citations41
US9099249B2Aug 4, 2015

Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH0 citations41
US10354800B2Jul 16, 2019

Multilayer ceramic electronic component, method of manufacturing the same, and print circuit board having the same embedded therein

SAMSUNG ELECTRO MECH0 citations39

HYUNDAI MOBIS CO LTD

1 patent