Inventor
HO SHU CHUEN
SG25 patents
⚠️ This page may combine multiple inventors who share the name “HO SHU CHUEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASM TECH SINGAPORE PTE LTD
19 patentsUS6877933B2Apr 12, 2005
Pellet feeding system for a molding machine
ASM TECH SINGAPORE PTE LTD24 citations92
US6770163B1Aug 3, 2004
Mold and method for encapsulation of electronic device
ASM TECH SINGAPORE PTE LTD81 citations92
US7901196B2Mar 8, 2011
Molding apparatus incorporating pressure uniformity adjustment
ASM TECH SINGAPORE PTE LTD8 citations81
US6988879B2Jan 24, 2006
Apparatus and method for reducing substrate warpage
ASM TECH SINGAPORE PTE LTD12 citations80
US6674165B2Jan 6, 2004
Mold for a semiconductor chip
ASM TECH SINGAPORE PTE LTD9 citations69
US10960583B2Mar 30, 2021
Molding system for applying a uniform clamping pressure onto a substrate
ASM TECH SINGAPORE PTE LTD3 citations67
US6869556B2Mar 22, 2005
Molding system for semiconductor packages
ASM TECH SINGAPORE PTE LTD5 citations61
US6860731B2Mar 1, 2005
Mold for encapsulating a semiconductor chip
ASM TECH SINGAPORE PTE LTD5 citations59
US7829004B2Nov 9, 2010
Transfer molding method and system for electronic devices
ASM TECH SINGAPORE PTE LTD6 citations57
US6752896B2Jun 22, 2004
Method of detaching a film of material from a substrate
ASM TECH SINGAPORE PTE LTD6 citations57
US6656320B2Dec 2, 2003
Removal of masking tape from lead frames
ASM TECH SINGAPORE PTE LTD2 citations57
US7030504B2Apr 18, 2006
Sectional molding system
ASM TECH SINGAPORE PTE LTD0 citations51
US6709252B2Mar 23, 2004
Molding apparatus
ASM TECH SINGAPORE PTE LTD1 citations50
US7927087B2Apr 19, 2011
Method and apparatus for molding with reduced cull formation
ASM TECH SINGAPORE PTE LTD1 citations48
US6808661B2Oct 26, 2004
Method for encapsulating leadframe-mounted integrated circuits
ASM TECH SINGAPORE PTE LTD0 citations47
US6736627B2May 18, 2004
Mold cleaning apparatus
ASM TECH SINGAPORE PTE LTD0 citations46
US7677874B2Mar 16, 2010
Vacuum molding apparatus
ASM TECH SINGAPORE PTE LTD0 citations43
US6986197B2Jan 17, 2006
Method of manufacturing an IC package
ASM TECH SINGAPORE PTE LTD0 citations42
US9947561B2Apr 17, 2018
Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
ASM TECH SINGAPORE PTE LTD0 citations34
HO SHU CHUEN
5 patentsUS8794952B2Aug 5, 2014
Apparatus for molding electronic components
HO SHU CHUEN0 citations43
US8292613B2Oct 23, 2012
Runner system for supplying molding compound
HO SHU CHUEN0 citations43
US8419404B2Apr 16, 2013
Modular molding assembly for electronic devices
HO SHU CHUEN0 citations40
US9346205B2May 24, 2016
Optical device molding system
HO SHU CHUEN0 citations33
US9487881B2Nov 8, 2016
Apparatus for electroplating a tooling for use in semiconductor device encapsulation
HO SHU CHUEN0 citations23