P

Inventor

YAN KAR WENG

SG6 patents
⚠️ This page may combine multiple inventors who share the name “YAN KAR WENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASMPT SINGAPORE PTE LTD

3 patents
US11955347B2Apr 9, 2024

Encapsulation process for double-sided cooled packages

ASMPT SINGAPORE PTE LTD0 citations45
US11676937B2Jun 13, 2023

Flexible sinter tool for bonding semiconductor devices

ASMPT SINGAPORE PTE LTD0 citations44
US11621181B2Apr 4, 2023

Dual-sided molding for encapsulating electronic devices

ASMPT SINGAPORE PTE LTD0 citations44

HO SHU CHUEN

2 patents
US8794952B2Aug 5, 2014

Apparatus for molding electronic components

HO SHU CHUEN0 citations43
US8292613B2Oct 23, 2012

Runner system for supplying molding compound

HO SHU CHUEN0 citations43

ASM TECH SINGAPORE PTE LTD

1 patent
US11227779B2Jan 18, 2022

Apparatus and method for processing a semiconductor device

ASM TECH SINGAPORE PTE LTD0 citations46