Inventor
KUO BOB SHIH-WEI
US26 patents
⚠️ This page may combine multiple inventors who share the name “KUO BOB SHIH-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
13 patentsUS7842541B1Nov 30, 2010
Ultra thin package and fabrication method
AMKOR TECHNOLOGY INC169 citations98
US7632753B1Dec 15, 2009
Wafer level package utilizing laser-activated dielectric material
AMKOR TECHNOLOGY INC55 citations98
US8030722B1Oct 4, 2011
Reversible top/bottom MEMS package
AMKOR TECHNOLOGY INC58 citations96
US9670445B1Jun 6, 2017
Microfluidics sensor package fabrication method and structure
AMKOR TECHNOLOGY INC32 citations92
US8354747B1Jan 15, 2013
Conductive polymer lid for a sensor package and method therefor
AMKOR TECHNOLOGY INC22 citations92
US8017436B1Sep 13, 2011
Thin substrate fabrication method and structure
AMKOR TECHNOLOGY INC33 citations90
US7750250B1Jul 6, 2010
Blind via capture pad structure
AMKOR TECHNOLOGY INC8 citations84
US9758372B1Sep 12, 2017
MEMS package with MEMS die, magnet, and window substrate fabrication method and structure
AMKOR TECHNOLOGY INC7 citations77
US10327076B1Jun 18, 2019
Top port MEMS package and method
AMKOR TECHNOLOGY INC3 citations71
US9359191B2Jun 7, 2016
Reversible top/bottom MEMS package
AMKOR TECHNOLOGY INC1 citations61
US9162871B1Oct 20, 2015
Metal mesh lid MEMS package and method
AMKOR TECHNOLOGY INC2 citations61
US7915715B2Mar 29, 2011
System and method to provide RF shielding for a MEMS microphone package
AMKOR TECHNOLOGY INC3 citations58
US9776855B2Oct 3, 2017
Reversible top/bottom MEMS package
AMKOR TECHNOLOGY INC0 citations51
KUO BOB SHIH-WEI
6 patentsUS8535961B1Sep 17, 2013
Light emitting diode (LED) package and method
KUO BOB SHIH-WEI41 citations93
US8536663B1Sep 17, 2013
Metal mesh lid MEMS package and method
KUO BOB SHIH-WEI35 citations92
US8809677B1Aug 19, 2014
Molded light guide for concentrated photovoltaic receiver module
KUO BOB SHIH-WEI7 citations83
US9013011B1Apr 21, 2015
Stacked and staggered die MEMS package and method
KUO BOB SHIH-WEI18 citations82
US8671565B1Mar 18, 2014
Blind via capture pad structure fabrication method
KUO BOB SHIH-WEI3 citations62
US8866004B1Oct 21, 2014
Frame interconnect for concentrated photovoltaic module
KUO BOB SHIH-WEI1 citations48