Inventor

VOLKSEN WILLI

US79 patents

⚠️ This page may combine multiple inventors who share the name “VOLKSEN WILLI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VOLKSEN WILLI

IBM

Direct photo-patterning of nanoporous organosilicates, and method of use

Dielectric compositions and method for their manufacture

Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets

Porous dielectric material and electronic devices fabricated therewith

Electronic devices with dielectric compositions and method for their manufacture

Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens

Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials

Process for manufacture of integrated circuit device using organosilicate insulative matrices

Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester

Process for manufacture of integrated circuit device

Porous organosilicates with improved mechanical properties

Process for manufacture of integrated circuit device

Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture

Method of forming low-K interlevel dielectric layers and structures

Materials having predefined morphologies and methods of formation thereof

Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials

Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens

Process for planarizing patterned metal structures for magnetic thin film heads

Surface plasma modification of porous thin-films to optimize pore filling

In-situ hardmask generation

Photosensitive polyimide precursors

Fine domain composite films of polyimide mixtures

Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester

Process for coating a substrate with polyimide

Photosensitive polyimide precursors

Circuit assembly with polyimide insulator

Determination of young&#39;S modulus of porous thin films using ultra-low load nano-indentation

Polyimide coating compositions based on meta-dialkyldihydrogen pyromellitate and aromatic diamines

Process for planarizing a substrate

Implementing the post-porosity plasma protection (P4) process using I-CVD

Enhanced adhesive materials and processes for 3D applications

Porous composition of matter, and method of making same

CALIFORNIA INST OF TECHN

Impregnated metal-polymeric functional beads

Cross-linked polyvinyl pyridine coated glass particle catalyst support and aqueous composition or polyvinyl pyridine adducted microspheres

Impregnated metal-polymeric functional beads

Polyvinyl pyridine microspheres

Polyvinyl pyridine microspheres

HITACHI GLOBAL STORAGE NETHERL

Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers

Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization

Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers

ARNOLD JOHN C

Methods to mitigate plasma damage in organosilicate dielectrics

Methods to mitigate plasma damage in organosilicate dielectrics

DUBOIS GERAUD JEAN-MICHEL

Homogeneous modification of porous films

Reduction of pore fill material dewetting

LABADIE JEFFREY W

Photosensitive polyamic alkyl ester composition and process for its use

BRUCE ROBERT L

Homogeneous porous low dielectric constant materials

PURUSHOTHAMAN SAMPATH

Homogeneous porous low dielectric constant materials

HEDRICK JAMES L

Enhanced adhesive materials and processes for 3D applications

CHA JENNIFER NAM

Method of forming a material having a predefined morphology

HITACHI GLOBAL STORAGE TECH

Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization

Determination of young'S modulus of porous thin films using ultra-low load nano-indentation