Inventor
CHANG SHENG-MING
TW23 patents
⚠️ This page may combine multiple inventors who share the name “CHANG SHENG-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
10 patentsUS10079192B2Sep 18, 2018
Semiconductor chip package assembly with improved heat dissipation performance
MEDIATEK INC8 citations84
US7880297B2Feb 1, 2011
Semiconductor chip having conductive member for reducing localized voltage drop
MEDIATEK INC10 citations82
US10194530B2Jan 29, 2019
Microelectronic system including printed circuit board having improved power/ground ball pad array
MEDIATEK INC3 citations71
US9609749B2Mar 28, 2017
Printed circuit board having power/ground ball pad array
MEDIATEK INC4 citations71
US9331054B2May 3, 2016
Semiconductor package assembly with decoupling capacitor
MEDIATEK INC2 citations62
US9883591B2Jan 30, 2018
Microelectronic system including printed circuit board having improved power/ground ball pad array
MEDIATEK INC1 citations60
US9674941B2Jun 6, 2017
Printed circuit board for mobile platforms
MEDIATEK INC1 citations52
US9131602B2Sep 8, 2015
Printed circuit board for mobile platforms
MEDIATEK INC0 citations52
US10083728B2Sep 25, 2018
Memory controller, memory module and memory system
MEDIATEK INC1 citations51
US11573264B2Feb 7, 2023
Device for testing chip or die with better system IR drop
MEDIATEK INC0 citations50