Inventor
STONE WILLIAM
CA7 patents
⚠️ This page may combine multiple inventors who share the name “STONE WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
4 patentsUS10002857B2Jun 19, 2018
Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
QUALCOMM INC10 citations79
US12218041B2Feb 4, 2025
Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods
QUALCOMM INC1 citations63
US11784157B2Oct 10, 2023
Package comprising integrated devices coupled through a metallization layer
QUALCOMM INC0 citations50
US9318405B2Apr 19, 2016
Wafer level package without sidewall cracking
QUALCOMM INC1 citations47