P

Inventor

PARK JONGHO

KR92 patents
⚠️ This page may combine multiple inventors who share the name “PARK JONGHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

21 patents
US10784260B2Sep 22, 2020

Semiconductor device

SAMSUNG ELECTRONICS CO LTD7 citations84
US11296078B2Apr 5, 2022

Semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations73
US10971938B2Apr 6, 2021

Electronic device including biosensor and operating method thereof

SAMSUNG ELECTRONICS CO LTD4 citations72
US11387236B2Jul 12, 2022

Semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations71
US11145738B2Oct 12, 2021

Semiconductor devices having multiple barrier patterns

SAMSUNG ELECTRONICS CO LTD3 citations71
US11107769B2Aug 31, 2021

Semiconductor package and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations70
US11101243B2Aug 24, 2021

Semiconductor package

SAMSUNG ELECTRONICS CO LTD4 citations70
US11147001B2Oct 12, 2021

Method and device for performing handover in wireless communication system

SAMSUNG ELECTRONICS CO LTD2 citations66
US12080712B2Sep 3, 2024

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11948994B2Apr 2, 2024

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11217677B2Jan 4, 2022

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11062116B2Jul 13, 2021

Electronic device including a plurality of light emitting units and a plurality of light receiving units

SAMSUNG ELECTRONICS CO LTD1 citations62
US12087650B2Sep 10, 2024

Interposer and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US12062661B2Aug 13, 2024

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US11688656B2Jun 27, 2023

Interposer and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US12550333B2Feb 10, 2026

Semiconductor switching devices having ferroelectric layers therein and methods of fabricating same

SAMSUNG ELECTRONICS CO LTD0 citations60
US11996365B2May 28, 2024

Semiconductor package and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US11778835B2Oct 3, 2023

Semiconductor switching devices having ferroelectric layers therein and methods of fabricating same

SAMSUNG ELECTRONICS CO LTD0 citations60
US11610845B2Mar 21, 2023

Semiconductor package and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US11610975B2Mar 21, 2023

Semiconductor devices having multiple barrier patterns

SAMSUNG ELECTRONICS CO LTD0 citations60
US11538801B2Dec 27, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations60

LG ELECTRONICS INC

15 patents

PARK JONGHO

4 patents

SEMICONDUCTOR COMPONENTS IND LLC

3 patents

LG CHEMICAL LTD

2 patents

LEE SUNGHWA

2 patents

AMOTECH CO LTD

1 patent

EPPSCORE CO LTD

1 patent

UNIV SUNGKYUNKWAN RES & BUS

1 patent

Showing the top 50 of 92 patents by PatentIndex Score.