Inventor
TOMIYAMA HIROMI
JP6 patents
Patents
6 patentsUS5576828ANov 19, 1996
Bonding wire detection method
SHINKAWA KK22 citations90
US5818958AOct 6, 1998
Wire bend inspection method and apparatus
SHINKAWA KK11 citations71
US5772040AJun 30, 1998
Workpiece conveying apparatus used with workpiece inspection device
SHINKAWA KK12 citations71
US5583641ADec 10, 1996
Bonding wire height detection method
SHINKAWA KK11 citations71
US10586781B2Mar 10, 2020
Bonding apparatus and method of estimating position of landing point of bonding tool
SHINKAWA KK3 citations69
US10816322B2Oct 27, 2020
Bonding apparatus and method for detecting height of bonding target
SHINKAWA KK0 citations40