Inventor
GAYNES MICHAEL
US13 patents
⚠️ This page may combine multiple inventors who share the name “GAYNES MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS7740713B2Jun 22, 2010
Flux composition and techniques for use thereof
IBM17 citations83
US7078802B2Jul 18, 2006
Method for bonding heat sinks to overmold material and resulting structure
IBM3 citations61
US6893523B2May 17, 2005
Method for bonding heat sinks to overmold material
IBM4 citations61
US11224927B2Jan 18, 2022
Circuit card attachment for enhanced robustness of thermal performance
IBM0 citations51
US10194522B2Jan 29, 2019
Thermal interface solution with reduced adhesion force
IBM0 citations51
US9686853B2Jun 20, 2017
Thermal interface solution with reduced adhesion force
IBM1 citations51
US10141236B2Nov 27, 2018
Flip chip ball grid array with low impedence and grounded lid
IBM0 citations48
US10043725B2Aug 7, 2018
Flip chip ball grid array with low impedence and grounded lid
IBM0 citations48
US7763188B2Jul 27, 2010
Electrically stable copper filled electrically conductive adhesive
IBM0 citations48
BEZAMA RASCHID JOSE
2 patentsUS8115303B2Feb 14, 2012
Semiconductor package structures having liquid coolers integrated with first level chip package modules
BEZAMA RASCHID JOSE28 citations91
US8772927B2Jul 8, 2014
Semiconductor package structures having liquid cooler integrated with first level chip package modules
BEZAMA RASCHID JOSE12 citations83