Inventor

OKADA SHIGEFUMI

JP5 patents

⚠️ This page may combine multiple inventors who share the name “OKADA SHIGEFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DISCO CORP

3 patents

US9390958B2Jul 12, 2016

Transfer unit including suction openings configured to receive suction pads or seal members therein

DISCO CORP3 citations69

US11456260B2Sep 27, 2022

Wafer processing method

DISCO CORP0 citations48

US9034735B2May 19, 2015

Laser processing method for workpiece

DISCO CORP0 citations33

INDYK RICHARD F

1 patent

US8652941B2Feb 18, 2014

Wafer dicing employing edge region underfill removal

INDYK RICHARD F10 citations77

IBM

1 patent

US10211175B2Feb 19, 2019

Stress-resilient chip structure and dicing process

IBM0 citations39