Inventor

MOHAMMED ILYAS

US281 patents

⚠️ This page may combine multiple inventors who share the name “MOHAMMED ILYAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOHAMMED ILYAS

XCELSIS CORP

Systems and methods for releveled bump planes for chiplets

Stacked IC structure with system level wiring on multiple sides of the IC die

3D chip with shared clock distribution network

Systems and methods for releveled bump planes for chiplets

3D Compute circuit with high density z-axis interconnects

3D processor

3D compute circuit with high density Z-axis interconnects

3D chip sharing power circuit

3D chip sharing data bus circuit

3D chip sharing data bus

3D chip sharing power interconnect layer

3D chip with shielded clock lines

3D chip sharing clock interconnect layer

Stacked IC structure with system level wiring on multiple sides of the IC die

HABA BELGACEM

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor

Cavities containing multi-wiring structures and devices

Multi-chip module with stacked face-down connected dies

Memory module in a package

Off-chip vias in stacked chips

Microelectronic packages and methods therefor

TESSERA INC

Reconstituted wafer level stacking

Microelectronic packages and methods therefor

Stacked packages

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages and methods therefor

Microelectronic packages having cavities for receiving microelectric elements

INVENSAS CORP

Structure for microelectronic packaging with bond elements to encapsulation surface

BVA interposer

Substrate-less stackable package with wire-bond interconnect

Structure for microelectronic packaging with bond elements to encapsulation surface

Embedded packaging with preformed vias

Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation

INVENSAS BONDING TECH INC

Direct-bonded lamination for improved image clarity in optical devices

Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics

Seal for microelectronic assembly

Bonded structures without intervening adhesive

MOHAMMED ILYAS

Substrate-less stackable package with wire-bond interconnect

Low stress vias

Interconnection elements with encased interconnects

Heat spreading substrate with embedded interconnects

OGANESIAN VAGE

Microelectronic elements with post-assembly planarization

Microelectronic elements having metallic pads overlying vias

Active chip on carrier or laminated chip having microelectronic element embedded therein

INVENSAS LLC

Nanowire bonding interconnect for fine-pitch microelectronics

SATO HIROAKI

Package-on-package assembly with wire bonds to encapsulation surface

ADEIA SEMICONDUCTOR INC

Integrated voltage regulator and passive components

PERCEIVE CORP

Compressive sensing based image capture using multi-lens array