Inventor
HUNG JUI-HSIANG
TW6 patents
Patents
6 patentsUS6437447B1Aug 20, 2002
Dual-sided chip package without a die pad
SILICONWARE PRECISION INDUSTRIES CO LTD33 citations89
US6680531B2Jan 20, 2004
Multi-chip semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD13 citations78
US6979886B2Dec 27, 2005
Short-prevented lead frame and method for fabricating semiconductor package with the same
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations71
US7410835B2Aug 12, 2008
Method for fabricating semiconductor package with short-prevented lead frame
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US6806565B2Oct 19, 2004
Lead-frame-based semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations58
US7008826B2Mar 7, 2006
Lead-frame-based semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47