Inventor

CHEUNG YIU MING

CN22 patents

⚠️ This page may combine multiple inventors who share the name “CHEUNG YIU MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEUNG YIU MING

ASM ASSEMBLY AUTOMATION LTD

Vibration-induced die detachment system

Apparatus for semiconductor chip detachment

Piezoelectric sensor for measuring bonding parameters

Configurable die detachment apparatus

Pick and place assembly for transporting a film of material

Apparatus and method for pick and place handling

Die detachment apparatus comprising pre-peeling structure

Driving mechanism for chip detachment apparatus

Apparatus and method for active alignment of optical components

Chuck for holding a workpiece

Ultrasonic cleaning module for singulated electronic packages

Apparatus and method for thin die detachment

Apparatus for loading electronic packages of varying sizes

Optical system having selectable field for inspection

ASM TECH SINGAPORE PTE LTD

Gang bonding process for assembling a matrix of light-emitting elements

Thermally-enhanced provision of underfill to electronic devices using a stencil

Die bonding with liquid phase solder

UNIV HONG KONG BAPTIST

Lip-password based speaker verification system

CHEUNG YIU MING

Thermal compression bonding of semiconductor chips

UNIV HONG KONG BAPTIST UNIV

Method and apparatus for eye gaze tracking

OR DEREK SIU WING

Method and system for bonding electrical devices using an electrically conductive adhesive

ASMPT SINGAPORE PTE LTD

Detaching a die from an adhesive tape by air ejection