Inventor
JEONG SUNG-WON
KR33 patents
⚠️ This page may combine multiple inventors who share the name “JEONG SUNG-WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
13 patentsUS10109588B2Oct 23, 2018
Electronic component package and package-on-package structure including the same
SAMSUNG ELECTRO MECH94 citations98
US9741630B2Aug 22, 2017
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations84
US10128179B2Nov 13, 2018
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRO MECH8 citations83
US10304807B2May 28, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10157886B2Dec 18, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH4 citations73
US10002811B2Jun 19, 2018
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
US10211136B2Feb 19, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH1 citations72
US10115648B2Oct 30, 2018
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRO MECH2 citations72
US10332855B2Jun 25, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH6 citations68
US9706668B2Jul 11, 2017
Printed circuit board, electronic module and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations68
US9929117B2Mar 27, 2018
Electronic component package and electronic device including the same
SAMSUNG ELECTRO MECH0 citations51
US9859243B2Jan 2, 2018
Electronic component package and electronic device including the same
SAMSUNG ELECTRO MECH1 citations51
US9142499B2Sep 22, 2015
Lead pin for package substrate
SAMSUNG ELECTRO MECH0 citations49
SAMSUNG ELECTRONICS CO LTD
12 patentsUS10522451B2Dec 31, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10461008B2Oct 29, 2019
Electronic component package having stress alleviation structure
SAMSUNG ELECTRONICS CO LTD3 citations72
US10446481B2Oct 15, 2019
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US12300594B2May 13, 2025
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11626364B2Apr 11, 2023
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11121066B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10861784B2Dec 8, 2020
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10679933B2Jun 9, 2020
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10490237B2Nov 26, 2019
Data storage device and method of operating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10545880B2Jan 28, 2020
Memory device and memory system performing an unmapped read
SAMSUNG ELECTRONICS CO LTD0 citations45
US9836220B2Dec 5, 2017
Data processing system and method of operating the same
SAMSUNG ELECTRONICS CO LTD0 citations37
US9292524B2Mar 22, 2016
File system and file storing method
SAMSUNG ELECTRONICS CO LTD0 citations31