Inventor
TAKEUCHI KAZUMASA
JP19 patents
⚠️ This page may combine multiple inventors who share the name “TAKEUCHI KAZUMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
11 patentsUS6475629B1Nov 5, 2002
Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device
HITACHI CHEMICAL CO LTD41 citations92
US6252010B1Jun 26, 2001
Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device
HITACHI CHEMICAL CO LTD39 citations92
US5532105AJul 2, 1996
Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board
HITACHI CHEMICAL CO LTD39 citations90
US6156870ADec 5, 2000
Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board
HITACHI CHEMICAL CO LTD22 citations89
US7138174B2Nov 21, 2006
Prepreg and a laminated sheet
HITACHI CHEMICAL CO LTD10 citations73
US11732124B2Aug 22, 2023
Compound and tablet
HITACHI CHEMICAL CO LTD1 citations62
US7871694B2Jan 18, 2011
Prepreg, metal-clad laminate and printed circuit board using same
HITACHI CHEMICAL CO LTD2 citations62
US7758951B2Jul 20, 2010
Prepreg, metal-clad laminate and printed circuit board using same
HITACHI CHEMICAL CO LTD4 citations62
US7648770B2Jan 19, 2010
Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
HITACHI CHEMICAL CO LTD4 citations62
US7947332B2May 24, 2011
Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
HITACHI CHEMICAL CO LTD2 citations57
US10251265B2Apr 2, 2019
Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
HITACHI CHEMICAL CO LTD0 citations36