Inventor
KUROMITSU YOSHIROU
JP37 patents
⚠️ This page may combine multiple inventors who share the name “KUROMITSU YOSHIROU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI MATERIALS CORP
25 patentsUS6033787AMar 7, 2000
Ceramic circuit board with heat sink
MITSUBISHI MATERIALS CORP120 citations95
US5213877AMay 25, 1993
Ceramic substrate used for fabricating electric or electronic circuit
MITSUBISHI MATERIALS CORP61 citations95
US6821616B1Nov 23, 2004
Protective thin film for FPDS, method for producing said thin film and FPDS using said thin film
MITSUBISHI MATERIALS CORP26 citations91
US9723707B2Aug 1, 2017
Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
MITSUBISHI MATERIALS CORP7 citations84
US9480144B2Oct 25, 2016
Power module substrate, power module substrate with heat sink, and power module
MITSUBISHI MATERIALS CORP8 citations84
US7138350B2Nov 21, 2006
MgO vapor deposition material and method for preparation thereof
MITSUBISHI MATERIALS CORP9 citations74
US6828588B2Dec 7, 2004
Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film
MITSUBISHI MATERIALS CORP6 citations74
US9968012B2May 8, 2018
Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate
MITSUBISHI MATERIALS CORP2 citations73
US9807865B2Oct 31, 2017
Substrate for power modules, substrate with heat sink for power modules, and power module
MITSUBISHI MATERIALS CORP5 citations73
US6995104B2Feb 7, 2006
Polycrystalline MgO deposition material having adjusted Si concentration
MITSUBISHI MATERIALS CORP9 citations73
US9504144B2Nov 22, 2016
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
MITSUBISHI MATERIALS CORP4 citations72
US5780162AJul 14, 1998
Aluminum nitride substrate and method of producing the same
MITSUBISHI MATERIALS CORP16 citations72
US9642275B2May 2, 2017
Power module
MITSUBISHI MATERIALS CORP2 citations70
US8921996B2Dec 30, 2014
Power module substrate, power module, and method for manufacturing power module substrate
MITSUBISHI MATERIALS CORP2 citations63
US9079264B2Jul 14, 2015
Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate
MITSUBISHI MATERIALS CORP2 citations62
US8044500B2Oct 25, 2011
Power module substrate, method for manufacturing power module substrate, and power module
MITSUBISHI MATERIALS CORP3 citations62
US11404622B2Aug 2, 2022
Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate
MITSUBISHI MATERIALS CORP0 citations61
US9237682B2Jan 12, 2016
Power module substrate with heat sink, and method for producing power module substrate with heat sink
MITSUBISHI MATERIALS CORP2 citations61
US9426915B2Aug 23, 2016
Power module
MITSUBISHI MATERIALS CORP2 citations60
US6872115B2Mar 29, 2005
Blade with comb teeth coated with a compound layer for forming ribs and its production method
MITSUBISHI MATERIALS CORP2 citations59
US9101063B2Aug 4, 2015
Power module substrate, power module, and method for manufacturing power module substrate
MITSUBISHI MATERIALS CORP0 citations52
US9095062B2Jul 28, 2015
Power module substrate, power module, and method for manufacturing power module substrate
MITSUBISHI MATERIALS CORP0 citations52
US10375825B2Aug 6, 2019
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
MITSUBISHI MATERIALS CORP0 citations51
US11380832B2Jul 5, 2022
Thermoelectric conversion module and method for producing thermoelectric conversion module
MITSUBISHI MATERIALS CORP0 citations49
US10607907B2Mar 31, 2020
Ceramic-aluminum conjugate, power module substrate, and power module
MITSUBISHI MATERIALS CORP0 citations40
KUROMITSU YOSHIROU
4 patentsUS8609993B2Dec 17, 2013
Power module substrate, power module, and method for manufacturing power module substrate
KUROMITSU YOSHIROU5 citations83
US8564118B2Oct 22, 2013
Power module substrate, power module, and method for manufacturing power module substrate
KUROMITSU YOSHIROU5 citations83
US8198540B2Jun 12, 2012
Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module
KUROMITSU YOSHIROU10 citations82
US9066433B2Jun 23, 2015
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
KUROMITSU YOSHIROU6 citations72
MITSUBISHI METAL CORP
3 patentsUS5130498AJul 14, 1992
Ceramic substrate used for fabricating electric or electronic circuit
MITSUBISHI METAL CORP39 citations91
US5087509AFeb 11, 1992
Substrate used for fabrication of thick film circuit
MITSUBISHI METAL CORP13 citations73
US5096768AMar 17, 1992
Substrate used for fabrication of thick film circuit
MITSUBISHI METAL CORP7 citations72