Inventor
LEE SINJAE
KR13 patents
⚠️ This page may combine multiple inventors who share the name “LEE SINJAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
8 patentsUS8836114B2Sep 16, 2014
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
STATS CHIPPAC LTD15 citations92
US8343810B2Jan 1, 2013
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
STATS CHIPPAC LTD18 citations92
US8003496B2Aug 23, 2011
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
STATS CHIPPAC LTD22 citations92
US8004093B2Aug 23, 2011
Integrated circuit package stacking system
STATS CHIPPAC LTD37 citations91
US7683469B2Mar 23, 2010
Package-on-package system with heat spreader
STATS CHIPPAC LTD32 citations91
US9401347B2Jul 26, 2016
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
STATS CHIPPAC LTD5 citations83
US9379064B2Jun 28, 2016
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
STATS CHIPPAC LTD4 citations72
US8937371B2Jan 20, 2015
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
STATS CHIPPAC LTD2 citations62
LEE SINJAE
2 patentsUS8531012B2Sep 10, 2013
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
LEE SINJAE13 citations82
US8569870B1Oct 29, 2013
Integrated circuit packaging system with shielding spacer and method of manufacture thereof
LEE SINJAE3 citations59