Inventor

SMITH MICHAEL ARNETT

US3 patents

⚠️ This page may combine multiple inventors who share the name “SMITH MICHAEL ARNETT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DU PONT

2 patents

US9153863B2Oct 6, 2015

Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

DU PONT35 citations88

US9579748B2Feb 28, 2017

Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape

DU PONT3 citations69

GORDON SCOTT E

1 patent

US8742262B2Jun 3, 2014

Low temperature co-fired ceramic structure for high frequency applications and process for making same

GORDON SCOTT E2 citations50