Inventor · disambiguated record
Wanchun Ding
Also filed as: DING WANCHUN
3 granted patents·1 pending application·1 citations·filing 2012–2015
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0156US9515010B2Semiconductor packaging structure and forming method thereforNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Dec 6, 2016·1 cites·8 claims
- 0234US2015380369A1Wafer packaging structure and packaging methodNANTONG FUJITSU MICROELECT CO·Filed 2014·Application pending·0 cites
- 0332US8890320B2Via arrangement and semiconductor device with the via arrangementSEMICONDUCTOR MFG INT CORP·Filed 2012·Granted Nov 18, 2014·0 cites·19 claims
- 0431US10008478B2Fabricating method for wafer-level packagingTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →