Inventor
YOON INSANG
KR12 patents
⚠️ This page may combine multiple inventors who share the name “YOON INSANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC PTE LTD
11 patentsUS10804217B2Oct 13, 2020
EMI shielding for flip chip package with exposed die backside
STATS CHIPPAC PTE LTD6 citations84
US10797039B2Oct 6, 2020
Semiconductor device and method of forming a 3D interposer system-in-package module
STATS CHIPPAC PTE LTD6 citations84
US10388637B2Aug 20, 2019
Semiconductor device and method of forming a 3D interposer system-in-package module
STATS CHIPPAC PTE LTD8 citations84
US11342278B2May 24, 2022
EMI shielding for flip chip package with exposed die backside
STATS CHIPPAC PTE LTD2 citations73
US10418341B2Sep 17, 2019
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant
STATS CHIPPAC PTE LTD4 citations72
US11842991B2Dec 12, 2023
Semiconductor device and method of forming a 3D interposer system-in-package module
STATS CHIPPAC PTE LTD0 citations62
US11715703B2Aug 1, 2023
EMI shielding for flip chip package with exposed die backside
STATS CHIPPAC PTE LTD0 citations62
US10629565B2Apr 21, 2020
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant
STATS CHIPPAC PTE LTD1 citations62
US11309193B2Apr 19, 2022
Semiconductor device and method of forming SIP module over film layer
STATS CHIPPAC PTE LTD0 citations61
US10804119B2Oct 13, 2020
Method of forming SIP module over film layer
STATS CHIPPAC PTE LTD1 citations61
US10319684B2Jun 11, 2019
Dummy conductive structures for EMI shielding
STATS CHIPPAC PTE LTD0 citations50