Inventor
WANG SW
MY5 patents
Patents
5 patentsUS10319639B2Jun 11, 2019
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations89
US10056317B1Aug 21, 2018
Semiconductor package with grounding device and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations67
US11791297B2Oct 17, 2023
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11244918B2Feb 8, 2022
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US10699989B2Jun 30, 2020
Semiconductor package with grounding device and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations46