Inventor
CHEW CH
MY5 patents
Patents
5 patentsUS10319639B2Jun 11, 2019
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations89
US11791297B2Oct 17, 2023
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11244918B2Feb 8, 2022
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11942369B2Mar 26, 2024
Thin semiconductor package for notched semiconductor die
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US10763173B2Sep 1, 2020
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations45