Inventor
KUROSE EIJI
JP28 patents
⚠️ This page may combine multiple inventors who share the name “KUROSE EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
26 patentsUS11404276B2Aug 2, 2022
Semiconductor packages with thin die and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US11342189B2May 24, 2022
Semiconductor packages with die including cavities and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US11562981B2Jan 24, 2023
Methods of forming semiconductor packages with back side metal
SEMICONDUCTOR COMPONENTS IND LLC1 citations72
US10943886B2Mar 9, 2021
Methods of forming semiconductor packages with back side metal
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US10529576B2Jan 7, 2020
Multi-faced molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US12469709B2Nov 11, 2025
Semiconductor package electrical contact structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations64
US12444609B2Oct 14, 2025
Silicon-on-insulator die support structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12431359B2Sep 30, 2025
Semiconductor package electrical contacts and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12374555B2Jul 29, 2025
Die sidewall coatings and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12374554B2Jul 29, 2025
Semiconductor packages with die including cavities and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12341014B2Jun 24, 2025
Multi-faced molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12230502B2Feb 18, 2025
Semiconductor package stress balance structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12040192B2Jul 16, 2024
Die sidewall coatings and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12040310B2Jul 16, 2024
Methods of forming semiconductor packages with back side metal
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11908699B2Feb 20, 2024
Semiconductor packages with die including cavities
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11901184B2Feb 13, 2024
Backmetal removal methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11894234B2Feb 6, 2024
Semiconductor packages with die support structure for thin die
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11404277B2Aug 2, 2022
Die sidewall coatings and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11393692B2Jul 19, 2022
Semiconductor package electrical contact structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11367619B2Jun 21, 2022
Semiconductor package electrical contacts and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11361970B2Jun 14, 2022
Silicon-on-insulator die support structures and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11348796B2May 31, 2022
Backmetal removal methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11328930B2May 10, 2022
Multi-faced molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11018030B2May 25, 2021
Fan-out wafer level chip-scale packages and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11791297B2Oct 17, 2023
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11244918B2Feb 8, 2022
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59