Inventor
LIEW HOW KIAT
MY8 patents
⚠️ This page may combine multiple inventors who share the name “LIEW HOW KIAT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
7 patentsUS10319639B2Jun 11, 2019
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations89
US9748163B1Aug 29, 2017
Die support for enlarging die size
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11791297B2Oct 17, 2023
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11244918B2Feb 8, 2022
Molded semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11942369B2Mar 26, 2024
Thin semiconductor package for notched semiconductor die
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US10825754B2Nov 3, 2020
Quad flat no leads package with locking feature
SEMICONDUCTOR COMPONENTS IND LLC1 citations55
US10763173B2Sep 1, 2020
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations45