Inventor
CHEN CHUNFU
JP13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHUNFU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HENKEL AG & CO KGAA
9 patentsUS10717907B2Jul 21, 2020
Photo-curable adhesive composition, preparation and use thereof
HENKEL AG & CO KGAA4 citations67
US11866535B2Jan 9, 2024
Two-part epoxy based composition
HENKEL AG & CO KGAA0 citations58
US11566151B2Jan 31, 2023
Photo-curable liquid optically clear adhesive composition and the use thereof
HENKEL AG & CO KGAA0 citations58
US11390742B2Jul 19, 2022
Epoxy based composition
HENKEL AG & CO KGAA0 citations57
US11873368B2Jan 16, 2024
Two component (2K) composition based on modified epoxy resin
HENKEL AG & CO KGAA0 citations51
US12577344B2Mar 17, 2026
One component (1K) composition based on epoxy resin
HENKEL AG & CO KGAA0 citations50
US12497505B2Dec 16, 2025
One component (1K) composition based on modified epoxy resin
HENKEL AG & CO KGAA0 citations50
US12338342B2Jun 24, 2025
One component (1K) composition based on epoxy resin
HENKEL AG & CO KGAA0 citations50
US10100236B2Oct 16, 2018
Light curable resin composition
HENKEL AG & CO KGAA0 citations48
HENKEL CORP
3 patentsUS6787606B1Sep 7, 2004
Electrochromic device with composition of epoxy resin, toughener and latent curative
HENKEL CORP56 citations94
US7795744B2Sep 14, 2010
Cationically curable epoxy resin composition
HENKEL CORP12 citations80
US7456230B2Nov 25, 2008
Cationically photocurable epoxy resin compositions
HENKEL CORP2 citations59