Inventor · disambiguated record
Toshihiro Hosoi
Also filed as: HOSOI TOSHIHIRO
15 granted patents·5 pending applications·21 citations·filing 2007–2023
86Inventor score
Files withMITSUI MINING & SMELTING CO LTD11DENSO CORP4MITSUI MINING & SMELTING CO3SUN A CORP1TOYODA GOSEI KK1
Top patents by PatentIndex Score
20 records- 0191US11670455B2Double-sided copper-clad laminateMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·11 claims
- 0289US8684399B2Gas generator and airbag apparatusTOYODA GOSEI KK·Filed 2013·Granted Apr 1, 2014·18 cites·14 claims
- 0376US12176150B2Double-sided copper-clad laminateMITSUI MINING & SMELTING CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 0469US12139592B2Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor elementMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·16 claims
- 0567US11166383B2Resin-clad copper foil, copper-clad laminated plate, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2016·Granted Nov 2, 2021·1 cites·10 claims
- 0658US11890853B2Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·18 claims
- 0758US10524360B2Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2018·Granted Dec 31, 2019·0 cites·11 claims
- 0857US11950376B2Copper-clad laminateMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·9 claims
- 0956US12351698B2Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·17 claims
- 1051US9924597B2Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 20, 2018·0 cites·4 claims
- 1150US2025227856A1Method for producing printed wiring board with built-in capacitor and multilayer printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 1249US7756265B2On-board hands-free communication apparatusDENSO CORP·Filed 2008·Granted Jul 13, 2010·0 cites·2 claims
- 1349US2025046520A1Double-sided copper clad laminate, capacitor element and printed wiring board with built-in capacitor, and method for manufacturing double-sided copper clad laminateMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
- 1448US11310910B2Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·10 claims
- 1548US2008069371A1Hands free system for vehicleDENSO CORP·Filed 2007·Application pending·0 cites
- 1645US12297354B2Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted May 13, 2025·0 cites·14 claims
- 1741US10134264B2Emergency report apparatusDENSO CORP·Filed 2015·Granted Nov 20, 2018·0 cites·6 claims
- 1840US2014111454A1Display apparatus for vehicle and information display deviceDENSO CORP·Filed 2012·Application pending·0 cites
- 1935US2011272768A1Lead Frame and Method of Producing Lead FrameSUN A CORP·Filed 2008·Application pending·0 cites
- 2034US10244640B2Copper clad laminate provided with protective layer and multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 26, 2019·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →