Inventor

LEE TSUNG-YEN

TW29 patents

⚠️ This page may combine multiple inventors who share the name “LEE TSUNG-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TSUNG-YEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure

Particle removal method

Multi-chip device and method of formation

Multi-chip device and method of formation

Organic interposer including stress-resistant bonding structures and methods of forming the same

Lithography system and method

Lithography system and method

Particle removal apparatus, particle removal system and particle removal method

Reticle pod

Package structure

Multi-chip device and method of formation

Semiconductor die with warpage release layer structure in package and fabricating method thereof

Package structure and method for forming the same

Method of lithography process and transferring a reticle

Semiconductor package and manufacturing method thereof

Method of lithography process using reticle container with discharging device

Package structure and method for forming the same

Multi-bump connection to interconnect structure and manufacturing method thereof

Semiconductor die with warpage release layer structure in package and fabricating method thereof

Reticle with conductive material structure

Particle removal apparatus

Lithography system and method

Method and apparatus for lithography in semiconductor fabrication

Method for discharging static charges on reticle

Lithography method

Method and apparatus for lithography in semiconductor fabrication

TPV ELECTRONICS FUJIAN CO LTD

Driving circuit for LED lamp

NAT UNIV TSING HUA

SERS-active structure, fabrication method thereof, and SERS system comprising the same

YU ZUO-SHANG

Driving circuit for single-string LED lamp