Inventor

ARORA VIVEK KISHORECHAND

US22 patents

⚠️ This page may combine multiple inventors who share the name “ARORA VIVEK KISHORECHAND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ARORA VIVEK KISHORECHAND

TEXAS INSTRUMENTS INC

Heat slug attached to a die pad for semiconductor package

IC package with half-bridge power module

Package panel processing with integrated ceramic isolation

Molded module package with an EMI shielding barrier

High voltage flip-chip on lead (FOL) package

Embedded die packaging with integrated ceramic substrate

Semiconductor package with isolated heat spreader

Power stage package including flexible circuit and stacked die

Semiconductor package with isolated heat spreader

Embedded die packaging with integrated ceramic substrate

High voltage flip-chip on lead (FOL) package

Stress buffer layer in embedded package

Embedded die package multichip module

Stress buffer layer in embedded package

Frame design in embedded die package

Package panel processing with integrated ceramic isolation

Electronic device with double-sided cooling

Power converter module

Package with stacked power stage and integrated control die

Power module with multi-layer substrate and second insulation layer to increase power density

Power conversion module and method of forming the same

NAT SEMICONDUCTOR CORP

Encapsulant material applicator for semiconductor wafers and method of use thereof