Inventor
COLGAN EVAN G
US126 patents
⚠️ This page may combine multiple inventors who share the name “COLGAN EVAN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
43 patentsUS6648485B1Nov 18, 2003
Highly collimating tapered light guide for uniform illumination of flat panel displays
IBM167 citations99
US6377233B2Apr 23, 2002
Micromechanical display and fabrication method
IBM203 citations99
US6323834B1Nov 27, 2001
Micromechanical displays and fabrication method
IBM137 citations99
US5625233AApr 29, 1997
Thin film multi-layer oxygen diffusion barrier consisting of refractory metal, refractory metal aluminide, and aluminum oxide
IBM116 citations99
US5281485AJan 25, 1994
Structure and method of making Alpha-Ta in thin films
IBM213 citations99
US5221449AJun 22, 1993
Method of making Alpha-Ta thin films
IBM206 citations99
US7990711B1Aug 2, 2011
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
IBM142 citations98
US7344907B2Mar 18, 2008
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
IBM82 citations98
US7342789B2Mar 11, 2008
Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
IBM130 citations98
US7230334B2Jun 12, 2007
Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
IBM66 citations98
US7180179B2Feb 20, 2007
Thermal interposer for thermal management of semiconductor devices
IBM60 citations98
US7002247B2Feb 21, 2006
Thermal interposer for thermal management of semiconductor devices
IBM65 citations98
US6483498B1Nov 19, 2002
Liquid crystal display with integrated resistive touch sensor
IBM199 citations98
US7928562B2Apr 19, 2011
Segmentation of a die stack for 3D packaging thermal management
IBM58 citations97
US7486513B2Feb 3, 2009
Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
IBM71 citations97
US7331796B2Feb 19, 2008
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM50 citations97
US6256080B1Jul 3, 2001
Self-aligned structures for improved wide viewing angle for liquid crystal displays
IBM83 citations97
US5831710ANov 3, 1998
Liquid crystal display
IBM106 citations97
US7836585B2Nov 23, 2010
Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM16 citations96
US7832094B2Nov 16, 2010
Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM16 citations96
US7832095B2Nov 16, 2010
Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM24 citations96
US7823283B2Nov 2, 2010
Method of forming a land grid array interposer
IBM16 citations96
US7665999B2Feb 23, 2010
Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane
IBM19 citations96
US7484966B2Feb 3, 2009
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM16 citations96
US7361025B2Apr 22, 2008
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM16 citations96
US7354277B2Apr 8, 2008
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
IBM20 citations96
US6400440B1Jun 4, 2002
Passive liquid crystal display having pre-tilt control structure and light absorbent material at a center
IBM59 citations96
US5565707AOct 15, 1996
Interconnect structure using a Al2 Cu for an integrated circuit chip
IBM54 citations96
US8037600B2Oct 18, 2011
Method of producing a land grid array interposer structure
IBM11 citations93
US6879098B2Apr 12, 2005
Display fabrication using modular active devices
IBM24 citations93
US6698077B2Mar 2, 2004
Display fabrication using modular active devices
IBM39 citations93
US6600528B2Jul 29, 2003
Integrated prism sheet for improved viewing angle in direct view color filterless liquid crystal displays
IBM29 citations93
US7948077B2May 24, 2011
Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement
IBM13 citations92
US7079393B2Jul 18, 2006
Fluidic cooling systems and methods for electronic components
IBM44 citations92
US6963119B2Nov 8, 2005
Integrated optical transducer assembly
IBM18 citations92
US6955481B2Oct 18, 2005
Method and apparatus for providing parallel optoelectronic communication with an electronic device
IBM43 citations92
US6752539B2Jun 22, 2004
Apparatus and system for providing optical bus interprocessor interconnection
IBM43 citations92
US5912506AJun 15, 1999
Multi-layer metal sandwich with taper and reduced etch bias and method for forming same
IBM42 citations92
US9470439B2Oct 18, 2016
Contaminant separator for a vapor-compression refrigeration apparatus
IBM10 citations84
US9059161B2Jun 16, 2015
Composite wiring board with electrical through connections
IBM11 citations84
US8901621B1Dec 2, 2014
Nanochannel process and structure for bio-detection
IBM11 citations84
US7888786B2Feb 15, 2011
Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device
IBM11 citations84
US7863070B2Jan 4, 2011
Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
IBM8 citations84
CORNELL RES FOUNDATION INC
2 patentsCAMPBELL LEVI A
2 patentsANDRY PAUL S
1 patentCOLGAN EVAN G
1 patentBRUNSCHWILER THOMAS J
1 patentShowing the top 50 of 126 patents by PatentIndex Score.