Inventor
DAVIS TARYN J
US11 patents
⚠️ This page may combine multiple inventors who share the name “DAVIS TARYN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS10504807B2Dec 10, 2019
Time temperature monitoring system
IBM5 citations82
US10032683B2Jul 24, 2018
Time temperature monitoring system
IBM10 citations82
US10553503B2Feb 4, 2020
Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
IBM2 citations72
US10134649B2Nov 20, 2018
Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
IBM2 citations72
US10008427B2Jun 26, 2018
Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
IBM3 citations72
US9911716B2Mar 6, 2018
Polygon die packaging
IBM3 citations72
US9818655B2Nov 14, 2017
Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
IBM2 citations72
US9437515B2Sep 6, 2016
Heat spreading layer with high thermal conductivity
IBM6 citations72
US10068812B2Sep 4, 2018
Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
IBM0 citations51
US10217682B2Feb 26, 2019
Time temperature monitoring system
IBM0 citations50