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Inventor
LIAN CHENZHOU
US
6 patents
⚠️ This page may combine multiple inventors who share the name “LIAN CHENZHOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
3 patents
US9437515B2
Sep 6, 2016
Heat spreading layer with high thermal conductivity
IBM
6 citations
72
US11825592B2
Nov 21, 2023
Electronic device console with natural draft cooling
IBM
0 citations
61
US10834808B2
Nov 10, 2020
Electronic device console with natural draft cooling
IBM
0 citations
51
GLOBALFOUNDRIES INC
1 patent
US9401315B1
Jul 26, 2016
Thermal hot spot cooling for semiconductor devices
GLOBALFOUNDRIES INC
16 citations
83
BERNIER WILLIAM E
1 patent
US8444043B1
May 21, 2013
Uniform solder reflow fixture
BERNIER WILLIAM E
11 citations
81
BODENWEBER PAUL F
1 patent
US9226426B2
Dec 29, 2015
Electronic device console with natural draft cooling
BODENWEBER PAUL F
2 citations
60