Inventor

FUJINAMI TOMOYUKI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “FUJINAMI TOMOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HONMA HIDEO

1 patent

US6193789B1Feb 27, 2001

Electroless copper plating solution and method for electroless copper plating

HONMA HIDEO12 citations67

HONMA NIDEO

1 patent

US6329072B1Dec 11, 2001

Microporous copper film and electroless copper plating solution for obtaining the same

HONMA NIDEO4 citations49

ASAKAWA TAKANOBU

1 patent

US8771409B2Jul 8, 2014

Electroless gold plating solution and electroless gold plating method

ASAKAWA TAKANOBU1 citations38