Inventor

MANUSHAROW MATHEW J

US56 patents

⚠️ This page may combine multiple inventors who share the name “MANUSHAROW MATHEW J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MANUSHAROW MATHEW J

INTEL CORP

Bridge interconnect with air gap in package assembly

High density interconnect device and method

Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same

Helical plated through-hole package inductor

Forming in-situ micro-feature structures with coreless packages

Size and efficiency of dies

Method of making an inductor

Improving size and efficiency of dies

Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same

High density interconnect device and method

Direct chip attach using embedded traces

Hybrid pitch package with ultra high density interconnect capability

Hybrid pitch package with ultra high density interconnect capability

Rlink—die to die channel interconnect configurations to improve signaling

Package-integrated microchannels

Inductor formed in substrate

Bridge interconnect with air gap in package assembly

Weaved electrical components in a substrate package core

Size and efficiency of dies

High performance integrated RF passives using dual lithography process

Size and efficiency of dies

Size and efficiency of dies

Helical plated through-hole package inductor

High performance integrated RF passives using dual lithography process

High density interconnect device and method

Package power delivery using plane and shaped vias

Package power delivery using plane and shaped vias

Integrated circuit package substrate

Bridge interconnect with air gap in package assembly

Landside stiffening capacitors to enable ultrathin and other low-Z products

Forming in-situ micro-feature structures with coreless packages

In situ-built pin-grid arrays for coreless substrates, and methods of making same

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation

MANUSHAROW MATHEW J

Direct external interconnect for embedded interconnect bridge package

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

Suspended inductor microelectronic structures

Integrated circuit package substrate

NALLA RAVI K

Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby

Forming in-situ micro-feature structures with coreless packages

Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby

Microelectronic package and method of manufacturing same

ROY MIHIR K

In situ-built pin-grid arrays for coreless substrates, and methods of making same

Method of forming a circuit board

TAHOE RES LTD

High density interconnect device and method

High density interconnect device and method

CHIU CHIA-PIN

Bridge interconnect with air gap in package assembly

CHASE HAROLD R

Non-cylindrical conducting shapes in multilayer laminated substrate cores

MALLIK DEBENDRA

Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

CHASE HAROLD RYAN

Substrate conductor structure and method