Inventor

RADHAKRISHNAN KALADHAR

US55 patents

⚠️ This page may combine multiple inventors who share the name “RADHAKRISHNAN KALADHAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RADHAKRISHNAN KALADHAR

INTEL CORP

Techniques and configurations associated with a capductor assembly

Integrated inductor

Array capacitor for decoupling multiple voltage rails

Integrating passive components on spacer in stacked dies

Microelectronic assemblies having an integrated voltage regulator chiplet

Surface-mount inductor structures for forming one or more inductors with substrate traces

Apparatus and method to reduce power losses in an integrated voltage regulator

Conformal power delivery structure for direct chip attach architectures

Two stage multi-input multi-output regulator

Integrated circuit package with improved power signal connection

Integrated circuit package with improved power signal connection

Microelectronic assemblies having magnetic core inductors

Package substrates with magnetic build-up layers

Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor

Array capacitors with voids to enable a full-grid socket

Array capacitor with IC contacts and applications

Magnetic small footprint inductor array module for on-package voltage regulator

Magnetic small footprint inductor array module for on-package voltage regulator

Backside recess in motherboard with thermally conductive mold

Microelectronic assemblies having an integrated voltage regulator chiplet

Package substrates with magnetic build-up layers

Package substrates with magnetic build-up layers

Multi-phase switching regulators with hybrid inductors and per phase frequency control

Package-integrated multi-turn coil embedded in a package magnetic core

Magnetic structures in integrated circuit package supports

Multi-layer embedded magnetic inductor coil

Package-integrated multi-turn coil embedded in a package magnetic core

Multi-level distributed clamps

Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator

Multi-voltage apparatus for electronics package including magnetic inductor and capacitor and manufacturing thereof

Integrated circuit packages, systems, and methods

Integrated circuit packages, systems, and methods

Array capacitors with voids to enable a full-grid socket

Coreless electronic substrates having embedded inductors

Via-in-via structure for high density package integrated inductor

Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard

Apparatus and method to reduce power losses in an integrated voltage regulator

Substrate integrated inductor with composite magnetic resin layer

Package using array capacitor core

Coaxial magnetic inductors with pre-fabricated ferrite cores

In situ inductor structure in buildup power planes

Planar magnetic radial inductors to enable VR disaggregation

Packaging architecture for disaggregated integrated voltage regulators

Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures

Method, device and system to protect circuitry during a burn-in process

Integrated circuit package with improved power signal connection

Reconfigurable inductor

Integrated inductor

JONES CHRISTOPHER C

Ceramic package substrate with recessed device

MANUSHAROW MATHEW J

Suspended inductor microelectronic structures