P

Inventor

HOANG GINA

US8 patents
⚠️ This page may combine multiple inventors who share the name “HOANG GINA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Henkel IP & Holding GmbH

5 patents
US9865551B2Jan 9, 2018

Methods to control wafer warpage upon compression molding thereof and articles useful therefor

Henkel IP & Holding GmbH8 citations82
US9305892B2Apr 5, 2016

Adhesive for electronic component

Henkel IP & Holding GmbH5 citations76
US9362105B2Jun 7, 2016

Pre-cut wafer applied underfill film on dicing tape

Henkel IP & Holding GmbH0 citations44
US9200184B2Dec 1, 2015

Chain extended epoxy to improve adhesion of conductive die attach film

Henkel IP & Holding GmbH1 citations43
US9281182B2Mar 8, 2016

Pre-cut wafer applied underfill film

Henkel IP & Holding GmbH0 citations34

NAT STARCH CHEM INVEST

1 patent
US6750301B1Jun 15, 2004

Die attach adhesives with epoxy compound or resin having allyl or vinyl groups

NAT STARCH CHEM INVEST54 citations90

DESIGNER MOLECULES INC

1 patent
US8378017B2Feb 19, 2013

Thermosetting adhesive compositions

DESIGNER MOLECULES INC2 citations56

HENKEL AG & CO KGAA

1 patent
US9780068B2Oct 3, 2017

Adhesive for electronic component

HENKEL AG & CO KGAA0 citations44