Inventor
VIVALDA JOHN
US12 patents
⚠️ This page may combine multiple inventors who share the name “VIVALDA JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYPRES INC
6 patentsUS8437818B1May 7, 2013
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits
HYPRES INC75 citations97
US9130116B1Sep 8, 2015
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits
HYPRES INC24 citations92
US10833243B1Nov 10, 2020
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits
HYPRES INC8 citations83
US9741918B2Aug 22, 2017
Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit
HYPRES INC8 citations83
US9741920B1Aug 22, 2017
System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits
HYPRES INC8 citations83
US10283694B2May 7, 2019
Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit
HYPRES INC3 citations72
SEEQC INC
5 patentsUS11508896B1Nov 22, 2022
Materials and methods for fabricating superconducting quantum integrated circuits
SEEQC INC6 citations71
US11991935B2May 21, 2024
Materials and methods for fabricating superconducting quantum integrated circuits
SEEQC INC2 citations70
US11121302B2Sep 14, 2021
System and method for superconducting multi-chip module
SEEQC INC2 citations69
US11711985B2Jul 25, 2023
System and method for superconducting multi-chip module
SEEQC INC2 citations68
US12317757B2May 27, 2025
System and method for superconducting multi-chip module
SEEQC INC0 citations58