Inventor
SRINIVASAN KRISHNA
US25 patents
⚠️ This page may combine multiple inventors who share the name “SRINIVASAN KRISHNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BUILDING MATERIALS INVEST CORP
9 patentsUS6286273B1Sep 11, 2001
Tile vent
BUILDING MATERIALS INVEST CORP82 citations95
US6993876B1Feb 7, 2006
Asphalt roofing composite including adhesion modifier-treated glass fiber mat
BUILDING MATERIALS INVEST CORP18 citations92
US6817152B2Nov 16, 2004
Fiber mats for materials of construction having improved tear strength and process for making same
BUILDING MATERIALS INVEST CORP24 citations92
US6706147B2Mar 16, 2004
Process for making fiber mats for materials of construction having improved tear strength
BUILDING MATERIALS INVEST CORP15 citations92
US6544909B1Apr 8, 2003
Single ply reinforced roofing membrane
BUILDING MATERIALS INVEST CORP41 citations92
US6544911B2Apr 8, 2003
Fiber mats for materials of construction having improved tear strength and process for making same
BUILDING MATERIALS INVEST CORP27 citations92
US7582155B2Sep 1, 2009
Asphalt nanocomposite-based roofing products
BUILDING MATERIALS INVEST CORP24 citations89
US6851240B2Feb 8, 2005
Shingle tear strength with fiber mixture of different fibers
BUILDING MATERIALS INVEST CORP30 citations89
US6737369B2May 18, 2004
Cured non-woven mat of a mixture of fibers
BUILDING MATERIALS INVEST CORP22 citations89
INTEL CORP
4 patentsUS10658279B2May 19, 2020
High density package interconnects
INTEL CORP6 citations84
US10204851B2Feb 12, 2019
High density package interconnects
INTEL CORP1 citations73
US9922916B2Mar 20, 2018
High density package interconnects
INTEL CORP3 citations73
US11264338B2Mar 1, 2022
Integrated circuit package with through void guard trace
INTEL CORP0 citations61