Inventor
SUGIYA TETSUKAZU
JP9 patents
Patents
9 patentsUS10937697B2Mar 2, 2021
Method of processing a semiconductor wafer that involves cutting to form grooves along the dicing lines and grinding reverse side of the wafer
DISCO CORP2 citations70
US10825678B2Nov 3, 2020
Wafer processing method
DISCO CORP2 citations70
US10366925B2Jul 30, 2019
Wafer processing method
DISCO CORP4 citations70
US10707129B2Jul 7, 2020
Processing method of wafer
DISCO CORP2 citations68
US9716040B2Jul 25, 2017
Wafer processing method using adhesive tape to pick up device chips
DISCO CORP6 citations68
US9786509B2Oct 10, 2017
Wafer processing method
DISCO CORP3 citations67
US9238288B2Jan 19, 2016
Method for processing plate object
DISCO CORP6 citations66
US10312144B2Jun 4, 2019
Method of dividing a wafer by back grinding
DISCO CORP1 citations58
US9852949B2Dec 26, 2017
Wafer processing method
DISCO CORP0 citations40