Inventor

CHOI KWANG-SEONG

KR35 patents

⚠️ This page may combine multiple inventors who share the name “CHOI KWANG-SEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI KWANG-SEONG

KOREA ELECTRONICS TELECOMM

Electroabsorption duplexer

Enhanced coplanar waveguide and optical communication module using the same

Vertically formed inductor and electronic device having the same

System for monitoring optical output/wavelength

Electronic device including LTCC inductor

Method for fabricating a semiconductor package

System and method for switching channels using tunable laser diodes

Wavelength stabilization module having light-receiving element array and method of manufacturing the same

Optical module and optical module package

Optical module

Impact-type piezoelectric micro power generator

Methods of forming bump and semiconductor device with the same

Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same

Measuring device and method of measuring signal transmission time difference thereof

ELECTRONICS & TELECOMMUNICATIONS RES INST

Method of fabricating a semiconductor package

Electronic device and its repair method

Method of manufacturing electric device

Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials

Wire for electric bonding

Laser bonding method

Method for manufacturing semiconductor package

Method for transferring and bonding of devices

Bonding structure of electronic equipment

Pattern-forming method for forming a conductive circuit pattern

YOUN CHUN JU

Polarization division multiplexed optical orthogonal frequency division multiplexing transmitter and receiver

Method and apparatus for transmitting and receiving coherent optical OFDM

Optical orthogonal frequency division multiplexing receiver and optical signal receiving method thereof

HYUNDAI ELECTRONICS IND

BGA semiconductor package improving solder joint reliability and fabrication method thereof

Ball grid array (BGA) semiconductor package improving solder joint reliability

EOM YONG SUNG

Method and structure for bonding flip chip

ELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE

Method of fabricating a semiconductor package

CHUNG YONG DUCK

Device and method for separation/conversion of multiband signal

BAE HYUN-CHEOL

Silicon interposer including backside inductor

CHOE JOONG-SEON

Adapter assembly and method for compensating optical fibers for length difference

ELECTRONICS AND TELECOMMUNIATIONS RES INST

Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same