Inventor
EOM YONG SUNG
KR30 patents
⚠️ This page may combine multiple inventors who share the name “EOM YONG SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOREA ELECTRONICS TELECOMM
12 patentsUS6707161B2Mar 16, 2004
Optical module package of flip chip bonding
KOREA ELECTRONICS TELECOMM20 citations92
US7520682B2Apr 21, 2009
Transceiver module and optical bench for passive alignment
KOREA ELECTRONICS TELECOMM9 citations83
US6825065B2Nov 30, 2004
Method for optical module packaging of flip chip bonding
KOREA ELECTRONICS TELECOMM9 citations73
US8044757B2Oct 25, 2011
Electronic device including LTCC inductor
KOREA ELECTRONICS TELECOMM4 citations62
US8030200B2Oct 4, 2011
Method for fabricating a semiconductor package
KOREA ELECTRONICS TELECOMM6 citations62
US7244923B2Jul 17, 2007
Surface emitting laser device including optical sensor and optical waveguide device employing the same
KOREA ELECTRONICS TELECOMM5 citations62
US7012939B2Mar 14, 2006
Wavelength stabilization module having light-receiving element array and method of manufacturing the same
KOREA ELECTRONICS TELECOMM3 citations62
US9006037B2Apr 14, 2015
Methods of forming bump and semiconductor device with the same
KOREA ELECTRONICS TELECOMM0 citations50
US9155236B2Oct 6, 2015
Composition and methods of forming solder bump and flip chip using the same
KOREA ELECTRONICS TELECOMM0 citations49
US8802760B2Aug 12, 2014
Composition and methods of forming solder bump and flip chip using the same
KOREA ELECTRONICS TELECOMM0 citations49
US9034750B2May 19, 2015
Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same
KOREA ELECTRONICS TELECOMM0 citations44
US7985697B2Jul 26, 2011
Wafer level package and method of fabricating the same
KOREA ELECTRONICS TELECOMM0 citations41
ELECTRONICS & TELECOMMUNICATIONS RES INST
12 patentsUS9490198B1Nov 8, 2016
Transmitting and receiving package
ELECTRONICS & TELECOMMUNICATIONS RES INST14 citations84
US10636761B2Apr 28, 2020
Method of fabricating a semiconductor package
ELECTRONICS & TELECOMMUNICATIONS RES INST6 citations66
US12457833B2Oct 28, 2025
Electronic device and its repair method
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US12349505B2Jul 1, 2025
Method of manufacturing electric device
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US12206056B2Jan 21, 2025
Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US11618109B2Apr 4, 2023
Wire for electric bonding
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US11107790B2Aug 31, 2021
Laser bonding method
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations61
US9462736B2Oct 4, 2016
Composition and methods of forming solder bump and flip chip using the same
ELECTRONICS & TELECOMMUNICATIONS RES INST1 citations59
US11488841B2Nov 1, 2022
Method for manufacturing semiconductor package
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations51
US11677060B2Jun 13, 2023
Method for transferring and bonding of devices
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations50
US9538666B2Jan 3, 2017
Bonding structure of electronic equipment
ELECTRONICS & TELECOMMUNICATIONS RES INST1 citations50
US9980393B2May 22, 2018
Pattern-forming method for forming a conductive circuit pattern
ELECTRONICS & TELECOMMUNICATIONS RES INST0 citations39